This inventor holds 1 USPTO granted patent. Top assignee: G.d. Searle & Company. Active years: 1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1994
Title: Craig T Vanderburg: Innovator in Tamper-Evident Packaging
Introduction
Craig T Vanderburg is a notable inventor based in Buffalo Grove, IL (US). He has made significant contributions to the field of packaging, particularly in the development of tamper-evident and child-resistant blister packages for medicaments. His innovative approach addresses safety concerns while maintaining user-friendliness.
Latest Patents
Vanderburg holds a patent for a novel tamper-evident, child-resistant blister package designed for both medicaments and nonmedicaments. This invention is particularly user-friendly, yet it poses challenges for young children and impaired adults attempting to open it. The blister package features pull tabs that are designed to be pulled away from the article-receiving pockets, allowing access to only one pocket at a time. This design not only enhances safety but also facilitates mass production, making it an attractive option for merchandising pharmaceutical and other products.
Career Highlights
Craig T Vanderburg is associated with G.D. Searle & Company, where he has contributed to various innovative projects. His work in developing safer packaging solutions has garnered attention in the industry, highlighting his commitment to improving consumer safety.
Collaborations
Vanderburg has collaborated with notable coworkers, including John M Bitner and Curtis E Hart. Their combined expertise has likely contributed to the success of their projects and innovations.
Conclusion
Craig T Vanderburg's contributions to tamper-evident packaging reflect his dedication to safety and innovation. His patent for child-resistant blister packages showcases his ability to address critical consumer needs while promoting effective design. Vanderburg's work continues to influence the packaging industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile