Craig S Wilson

Title: Innovations by Craig S. Wilson

Introduction

Craig S. Wilson is an accomplished inventor based in Brookline, NH (US). He has made significant contributions to the field of printed circuit board technology. With a total of two patents to his name, Wilson's work has advanced the manufacturing processes in this critical area of electronics.

Latest Patents

Wilson's latest patents include a process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards. This innovative process involves immersing a copper sheet in a first immersion tin solution to deposit a heavy tin layer, followed by a second immersion to create a thin tin deposit. The resulting rough surface texture enhances mechanical adhesion for subsequent bonding with epoxy or other polymers. His second patent focuses on a rigid/flex printed circuit board and its manufacturing method. This involves forming electrical traces on a flexible multi-layer circuit structure and applying a protective barrier material through an electroless process. The method allows for the creation of flexible areas within the circuit board, enhancing its functionality.

Career Highlights

Craig S. Wilson is currently associated with Parlex Corporation, where he continues to innovate in the field of circuit board technology. His expertise and inventions have played a vital role in improving manufacturing techniques and product performance.

Collaborations

Some of Wilson's notable coworkers include Darryl J. McKenney and Arthur J. Demaso. Their collaborative efforts contribute to the advancements in the technologies developed at Parlex Corporation.

Conclusion

Craig S. Wilson's contributions to printed circuit board technology through his patents demonstrate his innovative spirit and commitment to advancing the field. His work continues to influence the electronics industry positively.