North Aurora, IL, United States of America

Craig M Ressler

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: J.l. Clark, Inc., American Snuff Company, LLC. Active years: 2007-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Craig M Ressler. Retrieved from https://idiyas.com/inventor/craig-m-ressler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 118(Granted Patents)


Company Filing History:


Years Active: 2007-2023

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3 patents (USPTO):Explore Patents

Title: The Innovations of Craig M Ressler

Introduction

Craig M Ressler is an accomplished inventor based in North Aurora, Illinois. He has made significant contributions to the field of container design, holding a total of three patents. His work primarily focuses on the development of innovative lids for metal and polymeric containers.

Latest Patents

Among his latest patents are the "Metal and Polymeric Container Lid" and "Container Lid." These inventions showcase his expertise in creating functional and efficient designs that enhance the usability of containers.

Career Highlights

Throughout his career, Craig has worked with notable companies such as J.L. Clark, Inc. and American Snuff Company, LLC. His experience in these organizations has allowed him to refine his skills and contribute to various projects that emphasize innovation in packaging.

Collaborations

Craig has collaborated with talented individuals in his field, including Gordon E VerWeyst and Richard L Peterson. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in container technology.

Conclusion

Craig M Ressler's contributions to container design through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence the development of practical and innovative packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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