Toronto, Canada

Craig J Hamilton

This inventor holds 1 USPTO granted patent. Top assignee: Celestica International Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Craig J Hamilton. Retrieved from https://idiyas.com/inventor/craig-j-hamilton

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Craig J Hamilton

Introduction

Craig J Hamilton is a notable inventor based in Toronto, Canada. He has made significant contributions to the field of soldering technology, particularly with his innovative approach to improving solder flow in electronic manufacturing.

Latest Patents

Hamilton holds a patent for a device known as the Laminar Flow Well. This invention addresses the issue of turbulent solder flow, which can lead to increased copper dissolution in plated through-holes (PTH) of printed circuit boards (PCBs). By creating a more laminar solder flow, his design aims to evenly distribute solder and reduce the rate of copper dissolution, especially during the PTH rework process. The flow well incorporates a flow distribution element that enhances the solder flow characteristics.

Career Highlights

Hamilton is currently associated with Celestica International Inc., where he applies his expertise in soldering technology. His work focuses on developing solutions that enhance manufacturing processes and improve product reliability.

Collaborations

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Conclusion

Craig J Hamilton's innovative contributions, particularly his Laminar Flow Well patent, demonstrate his commitment to advancing soldering technology in the electronics industry. His work continues to influence manufacturing practices and improve product quality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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