Merrimack, NH, United States of America

Craig Hare

This inventor holds 1 USPTO granted patent. Top assignee: Ultrasource, Inc.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Craig Hare. Retrieved from https://idiyas.com/inventor/craig-hare

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: The Innovations of Craig Hare

Introduction

Craig Hare is an accomplished inventor based in Merrimack, NH (US). He has made significant contributions to the field of electrical engineering, particularly through his innovative patent.

Latest Patents

Craig Hare holds a patent for a "Method and apparatus for an improved filled via." This invention involves a system that contains a substrate with at least one electrical trace formed on it. An opening is created in the substrate, which comprises at least one wall. An electrically conductive fill is formed in this opening, chemically bonding to the wall and establishing electrical contact with the electrical trace. This innovation enhances the reliability and efficiency of electrical connections in various applications.

Career Highlights

Craig is currently employed at Ultrasource, Inc., where he continues to develop and refine his inventions. His work at the company has allowed him to explore new technologies and improve existing systems.

Collaborations

Some of Craig's notable coworkers include Michael D Casper and Adam Cook. Their collaboration fosters a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Craig Hare's contributions to the field of electrical engineering through his patent demonstrate his commitment to innovation. His work at Ultrasource, Inc. and collaborations with talented colleagues further enhance his impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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