Craig D Higgins

Title: Innovations of Craig D Higgins

Introduction

Craig D Higgins is an accomplished inventor based in Altamont, NY (US). He has made significant contributions to the field of photolithography, holding two patents that showcase his innovative approaches to reducing defects in semiconductor manufacturing.

Latest Patents

Higgins' latest patents include methods and structures that reduce stochastic defects in photolithography. One of his notable inventions involves a multi-layer stack that includes a photoresist layer on an underlayer. The materials used for the photoresist layer and underlayer are selected to create an effective electric field, which facilitates the movement of radiation-excited electrons during the photolithography process. This innovation improves the development of the photoresist layer and enhances pattern resolution. Another significant patent is the litho-litho-etch double patterning method. This method involves forming a resist layer, exposing it to UV rays, and developing it with both positive and negative developers to create intricate patterns.

Career Highlights

Craig D Higgins is currently employed at GlobalFoundries Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing photolithography techniques, which are critical for the production of integrated circuits.

Collaborations

Higgins has collaborated with notable coworkers such as Yong Liang and Lei Sun. Their combined expertise has contributed to the successful development of innovative solutions in the semiconductor industry.

Conclusion

Craig D Higgins is a prominent inventor whose work in photolithography has led to significant advancements in semiconductor manufacturing. His patents reflect a deep understanding of materials and processes that enhance the efficiency and effectiveness of photolithography techniques.