New York, NY, United States of America

Craig B Hayman

This inventor holds 1 USPTO granted patent. Top assignee: Seer Technologies, Inc.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Craig B Hayman. Retrieved from https://idiyas.com/inventor/craig-b-hayman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 18.0

ph-index = 1

Forward Citations = 83(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Craig B. Hayman and Computer-Aided Software Engineering

Introduction

Craig B. Hayman is an inventor associated with New York, New York, and Seer Technologies, Inc. His patent work focuses on tools for designing reusable software that can operate across different hardware environments.

Latest Patents

Hayman is credited with 1 patent, titled “Computer-Aided Software Engineering Facility.” The invention describes a facility and method for creating source code and executable programs that can be distributed across multiple hardware platforms. It links object-oriented models with programming-language modules and other system components to support efficient software design and reuse. The models and modules are stored centrally and distributed to the hardware elements that make up the computer system.

Career Highlights

Hayman’s listed patent reflects work in computer-aided software engineering, particularly the development of reusable software components for varied computing environments. The patent identifies Seer Technologies, Inc. in connection with his professional background.

Collaborations

Hayman’s listed coworkers include Joel M. Moskowitz and Rajan S. Modi.

Conclusion

Craig B. Hayman’s patent describes an approach to building and distributing reusable software across multiple hardware platforms, highlighting his contribution to computer-aided software engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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