Craig B Geiger

Title: Craig B Geiger: Innovator in Wafer Level Packaging

Introduction

Craig B Geiger is a notable inventor based in Downey, CA (US). He has made significant contributions to the field of semiconductor packaging, particularly in the integration of Monolithic Microwave Integrated Circuit (MMIC) and Micro Electromechanical Systems (MEMS) components.

Latest Patents

Geiger holds a patent for a method of fabricating high yield wafer level packages that integrate MMIC and MEMS components. This innovative process involves integrating these components onto a single substrate at a wafer scale. The method begins with the fabrication of MMIC and MEMS on the front face of a thick substrate wafer. The substrate wafer is then bonded to a cover wafer, followed by thinning the back face of the substrate wafer. Finally, the fabrication process is completed on the back face of the thinned substrate wafer. A guard ring is utilized between the wafers to provide additional mechanical support and protect the devices during fabrication. The process is further enhanced by a low-temperature bonding technique that joins the substrate and cover wafers at multiple device cavity seal rings.

Career Highlights

Craig B Geiger is currently employed at Northrop Grumman Systems Corporation, where he continues to advance his work in semiconductor technologies. His expertise in wafer level packaging has positioned him as a key player in the industry.

Collaborations

Geiger has collaborated with notable colleagues, including Patty P Chang-Chien and Kelly J Tomquist, contributing to various projects that enhance the capabilities of semiconductor devices.

Conclusion

Craig B Geiger's innovative work in wafer level packaging exemplifies the advancements in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.