The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Jun. 23, 2005
Patty P. Chang-chien, Redondo Beach, CA (US);
Kelly J. Tomquist, Torrance, CA (US);
Craig B. Geiger, Downey, CA (US);
Alvin M. Kong, Manhattan Beach, CA (US);
Patty P. Chang-Chien, Redondo Beach, CA (US);
Kelly J. Tomquist, Torrance, CA (US);
Craig B. Geiger, Downey, CA (US);
Alvin M. Kong, Manhattan Beach, CA (US);
Northrop Gruman Corp., Los Angeles, CA (US);
Abstract
Monolithic microwave integrated circuit (MMIC) components and micro electromechanical systems (MEMS) components are integrated onto a single substrate at a wafer scale, by first performing MMIC and MEMS fabrication on a front face of a thick substrate wafer, bonding the substrate wafer to a cover wafer, thinning the back face of the substrate wafer and, finally, completing MMIC and MEMS fabrication on the back face of the thinned substrate wafer. The fabrication process is facilitated by use of a guard ring between the wafers to provide additional mechanical support to the substrate wafer and to protect the devices while the MMIC/MEMS fabrication is completed, and by a low temperature bonding process to join the substrate wafer and the cover wafer at multiple device cavity seal rings.