Wilmette, IL, United States of America

Congwen Duan

This inventor holds 1 USPTO granted patent. Top assignee: Northwestern University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Congwen Duan. Retrieved from https://idiyas.com/inventor/congwen-duan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Congwen Duan in Photo-Reactive Inks

Introduction

Congwen Duan is an accomplished inventor based in Wilmette, IL (US). He has made significant contributions to the field of materials science, particularly in the development of photo-reactive inks and thermal-curable materials. His work has implications for various applications, including medical devices and implants.

Latest Patents

Congwen Duan holds a patent for "Photo-reactive inks and thermal-curable materials made therefrom." This patent encompasses the formulation of photo-reactive inks, thermal-curable materials, and the objects created from these materials, such as medical implants and scaffolds. The methods of preparation and use of these materials are also detailed in his patent, showcasing his innovative approach to material development.

Career Highlights

Congwen Duan is affiliated with Northwestern University, where he contributes to research and development in advanced materials. His expertise in photo-reactive inks positions him as a key figure in the intersection of chemistry and engineering.

Collaborations

He has collaborated with notable colleagues, including Guillermo A. Ameer and Henry Oliver Tenadooah Ware. These partnerships enhance the research output and innovation potential within his field.

Conclusion

Congwen Duan's work in photo-reactive inks and thermal-curable materials represents a significant advancement in material science. His contributions are paving the way for new applications in medical technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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