Beijing, China

Cong Zeng

This inventor holds 2 USPTO granted patents. Top assignee: Lenovo (Beijing) Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cong Zeng. Retrieved from https://idiyas.com/inventor/cong-zeng-xmf2ckj4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Cong Zeng: Innovator in Electronic Devices

Introduction

Cong Zeng is a prominent inventor based in Beijing, China. He has made significant contributions to the field of electronic devices, holding a total of 2 patents. His work focuses on enhancing the functionality and protection of electronic components.

Latest Patents

Cong Zeng's latest patents include an innovative electronic device with a protection structure. This device features a display output component with a display region, a display protection component, and a through-hole designed to expose a target component along a specific direction. Additionally, he has developed a thermal conductive element that includes a thermal conductive sheet and a target piece. The target piece is strategically placed in a target area of the thermal conductive sheet, allowing it to deform and create a first protrusion.

Career Highlights

Cong Zeng is currently employed at Lenovo (Beijing) Limited, where he continues to push the boundaries of technology. His work at Lenovo has allowed him to collaborate with other talented professionals in the industry.

Collaborations

One of his notable coworkers is Xiong Li, with whom he shares insights and ideas to further innovate in their field.

Conclusion

Cong Zeng's contributions to electronic devices demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications in everyday life.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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