This inventor holds 1 USPTO granted patent. Top assignee: Amd Design, LLC. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Cong Yao and a Cooling Innovation for High-Power AI Servers
Introduction
Cong Yao is an inventor associated with Secaucus, New Jersey, and Amd Design, LLC. His patent work addresses thermal management in high-power AI servers, where effective cooling can help support reliable operation.
Latest Patents
Yao is named on 1 patent, titled “Moat heatsink for VRs in high power AI servers.” The invention describes an apparatus for cooling a primary heat source surrounded by multiple secondary heat sources. A second heat sink is attached to a first heat sink connected to the primary source, allowing the first heat sink to hold the second against the surrounding sources without requiring dedicated mounts on the device. The design can also distribute heat pipes among the first heat sink’s fins and use opposing sides of the heat sink to form a duct that channels airflow.
Career Highlights
Yao’s listed patent reflects work on compact cooling arrangements for densely packed server components. By using the primary heat sink to secure the secondary heat sink, the design aims to simplify mounting while improving heat transfer and airflow management.
Collaborations
Yao is associated with Amd Design, LLC. His listed coworker is Sunilkumar Pinnu.
Conclusion
Cong Yao’s patent presents a practical approach to cooling multiple heat sources in high-power AI servers by combining heat-sink attachment, heat-pipe placement, and directed airflow.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile