Company Filing History:
Years Active: 2019-2025
Title: Cong-Wei Chen: Innovator in Semiconductor Packaging
Introduction
Cong-Wei Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging structures. His innovative work has led to the development of a unique semiconductor package structure that enhances performance and reliability.
Latest Patents
Cong-Wei Chen holds a patent for a semiconductor package structure having a protection layer. This invention includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements, and a redistribution layer. The semiconductor die is positioned on the semiconductor substrate, while the encapsulant covers a portion of the semiconductor die, featuring a first surface and a lateral surface. The protection layer is designed to cover both the first surface and the lateral surface of the encapsulant. Surrounding the lateral surface of the encapsulant are the conductive elements, and the redistribution layer serves to electrically connect the semiconductor die and the conductive elements. This innovative design aims to improve the durability and efficiency of semiconductor packages.
Career Highlights
Cong-Wei Chen is currently employed at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work at this organization has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Some of his notable coworkers include Yuan-Feng Chiang and I-Ting Chi. Their collective expertise and teamwork have played a crucial role in the success of various projects within the company.
Conclusion
Cong-Wei Chen's contributions to semiconductor packaging technology exemplify his innovative spirit and dedication to advancing the field. His patent for a semiconductor package structure with a protection layer showcases his ability to address industry challenges effectively.