Basingstoke, United Kingdom

Colin Statham

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nexans. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Colin Statham. Retrieved from https://idiyas.com/inventor/colin-statham

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Colin Statham: Innovator in Connection Technology

Introduction

Colin Statham is a notable inventor based in Basingstoke, GB. He has made significant contributions to the field of connection technology, particularly with his innovative designs that enhance connectivity solutions.

Latest Patents

Statham holds a patent for a "Clippable interconnection module and associated connection cord." This interconnection module features a pair of spring-loaded conductive pins and a molded body in which a portion of the pins is embedded. At least one end of each pin projects from the body, which forms a hollow volume, making the module clippable. This design offers a practical solution for connecting cords to panels efficiently.

Career Highlights

Throughout his career, Colin Statham has worked with several prominent companies, including Nexans and Aginode Group. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Statham has collaborated with notable coworkers such as John Maddocks and Martin Rossbach. Their combined expertise has likely fostered a creative environment that encourages innovation.

Conclusion

Colin Statham's contributions to connection technology through his patent and professional experience highlight his role as an influential inventor in the industry. His work continues to impact the way we connect and interact with technology today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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