Brantford, Canada

Colin Scott

This inventor holds 1 USPTO granted patent and 2 published patent applications, plus 4 CIPO patents and 1 EPO patent. Top assignee: Arcelormittal. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Colin Scott. Retrieved from https://idiyas.com/inventor/colin-scott-qbzy1q3d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 


 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Colin Scott: Inventor of TWIP Steel Technology.

Introduction

Colin Scott is an inventor associated with Brantford, Canada, and ArcelorMittal. His recorded patent work concerns a steel sheet designed with a twinning-induced plasticity (TWIP) steel composition and an austenitic matrix.

Latest Patents

Scott is associated with 1 patent, titled “TWIP Steel Sheet Having an Austenitic Matrix.” The patent describes a steel sheet with specified ranges of carbon, manganese, silicon, copper, aluminum, and vanadium, alongside limits for sulfur, phosphorus, and nitrogen. Depending on the aluminum content, it sets conditions for the aluminum-to-vanadium ratio or the minimum vanadium content. The composition may also include optional elements such as niobium, boron, chromium, molybdenum, nickel, titanium, and tin, with iron and unavoidable impurities making up the remainder.

Career Highlights

Scott’s listed invention addresses the composition of austenitic TWIP steel. The patent’s detailed alloy ranges define the material’s chemical makeup and distinguish its formulation.

Collaborations

Scott’s listed coworkers include Blandine Remy and Marie-Christine Theyssier. His company affiliation is ArcelorMittal.

Conclusion

Colin Scott’s recorded patent contribution is a specified austenitic TWIP steel sheet composition, developed in connection with his work at ArcelorMittal.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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