Colin D Parnell

Title: Colin D Parnell: Innovator in Packaging Technology

Introduction

Colin D Parnell is a notable inventor based in Cellina Di Leggiuno, Italy. He has made significant contributions to the field of packaging technology, holding 2 patents that showcase his innovative approach to materials used in food packaging.

Latest Patents

His latest patents include a multi-layer film useful in food packaging. This film comprises a first core layer made of VLDPE or LLDPE, optionally a second core layer of the same materials, and two outer layers each consisting of an ionomer. Additionally, the film may include further core layers and an oxygen barrier layer, which can be oriented to provide a heat shrinkable film. Another patent focuses on a multi-layer thermoplastic shrinkable film with improved processing properties. This film includes a heat sealing VLDPE layer, a core oxygen barrier layer, and an outer thermoplastic layer, with an intermediate VLDPE layer positioned between the barrier and the outer layer.

Career Highlights

Colin D Parnell is associated with W.R. Grace & Co. - Conn., where he applies his expertise in developing advanced packaging solutions. His work has significantly impacted the efficiency and effectiveness of food packaging materials.

Collaborations

He collaborates with Tito A Fornasiero, contributing to innovative projects that enhance packaging technology.

Conclusion

Colin D Parnell's contributions to packaging technology through his patents reflect his commitment to innovation in the field. His work continues to influence the industry, making food packaging safer and more efficient.