This inventor holds 1 USPTO granted patent and 1 published patent application, plus 2 CIPO patents. Top assignee: Intercontinental Great Brands LLC. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Colin Bosworth: Innovator in Tubular Packaging Technology
Introduction
Colin Bosworth is a notable inventor based in Leicestershire, GB. He has made significant contributions to the field of packaging technology, particularly with his innovative approach to producing tubular packages. His work has implications for various industries that rely on efficient packaging solutions.
Latest Patents
Colin Bosworth holds a patent for an "Apparatus and method for producing tubular packages." This apparatus includes a packaging material dispenser and a forming section. The forming section comprises a progressive folding region that features a plurality of discrete, elongate external guide surfaces extending generally in the machine direction. These guide surfaces are designed to progressively guide and fold the packaging material around a longitudinal axis, transforming it from a planar configuration into a tubular structure. The apparatus can be configured as either a horizontal or vertical form, fill seal type apparatus, and is suitable for semi-rigid packaging materials such as paperboard, cartonboard, or semi-rigid plastics.
Career Highlights
Colin Bosworth is currently associated with Intercontinental Great Brands LLC, where he applies his expertise in packaging technology. His innovative designs and methods have enhanced the efficiency and effectiveness of packaging processes within the company.
Collaborations
Colin has collaborated with talented coworkers such as Ben Thistleton and Leesha Muman. Their combined efforts contribute to the advancement of packaging technology and innovation.
Conclusion
Colin Bosworth's contributions to the field of packaging technology, particularly through his patented apparatus for producing tubular packages, highlight his role as an innovator. His work continues to influence the industry and improve packaging solutions.