Akron, OH, United States of America

Clinton J Taubert


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Clinton J Taubert

Introduction

Clinton J Taubert is an accomplished inventor based in Akron, OH. He has made significant contributions to the field of electrically conductive materials, particularly through his innovative patent. His work is recognized for its potential applications in various industries, showcasing the importance of research and development in advancing technology.

Latest Patents

Clinton J Taubert holds a patent for "Electrically conductive polymer adhesives with complex dimensional filters." This invention involves an electrically conductive polymer composition that includes a conductive metal filler material made up of a plurality of metal particles. Additionally, it incorporates one or more carbon-based filler materials that are substantially homogenously dispersed throughout a polymer matrix. Notably, the aspect ratio of the carbon-based filler material is at least ten times greater than that of the conductive metal filler material. The carbon-based filler materials may include carbon nanotubes, multi-walled carbon nanotubes, and edge-functionalized graphene.

Career Highlights

Clinton J Taubert is affiliated with the University of Akron, where he continues to engage in research and development. His work has contributed to the advancement of materials science, particularly in the area of conductive polymers. His innovative approach has garnered attention in both academic and industrial circles.

Collaborations

Throughout his career, Clinton has collaborated with notable colleagues, including Yu Zhu and Bryan D Vogt. These collaborations have further enriched his research and have led to advancements in the field of electrically conductive materials.

Conclusion

Clinton J Taubert's contributions to the field of electrically conductive polymers highlight the importance of innovation in material science. His patent reflects a significant advancement that could have wide-ranging applications. His work at the University of Akron and collaborations with esteemed colleagues underscore his commitment to pushing the boundaries of technology.

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