Nashua, NH, United States of America

Cliff Firth

This inventor holds 1 USPTO granted patent. Top assignee: Microchip Technology Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cliff Firth. Retrieved from https://idiyas.com/inventor/cliff-firth

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Cliff Firth

Introduction

Cliff Firth is a notable inventor based in Nashua, NH (US). He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique patent that addresses specific challenges in the industry.

Latest Patents

Cliff Firth holds a patent for a Low-profile sealed surface-mount package. This invention features a hermetically sealed semiconductor die package with a sidewall structure that includes a first and second opening. The design incorporates a lid that hermetically seals the first opening and a substrate that seals the second opening. The substrate is equipped with first, second, and third apertures, each sealed by a corresponding button. This innovative design enhances the reliability and performance of semiconductor devices.

Career Highlights

Cliff Firth is currently employed at Microchip Technology Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of surface-mount packages, making them more efficient and reliable.

Collaborations

Throughout his career, Cliff has collaborated with talented individuals such as David Doiron and Christopher Alan Barnes. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Cliff Firth's contributions to the field of semiconductor technology exemplify the spirit of innovation. His patent for the Low-profile sealed surface-mount package showcases his ability to solve complex problems in the industry. As he continues his work at Microchip Technology Inc., his impact on technology will undoubtedly grow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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