Howe, TX, United States of America

Clessie Troxtell

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Clessie Troxtell. Retrieved from https://idiyas.com/inventor/clessie-troxtell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Clessie Troxtell and Semiconductor Packaging Innovation.

Introduction

Clessie Troxtell is an inventor associated with Howe, Texas, and Texas Instruments Corporation. His patent work addresses the storage and handling of encapsulated semiconductor devices.

Latest Patents

Troxtell is credited with one patent, titled “Lightweight, High Temperature Packing Reel for Integrated Circuits.” The invention describes a lightweight reel for storing encapsulated semiconductor devices that can withstand extended baking at temperatures high enough to desorb moisture from the packages. Its design also supports efficient heat and airflow through the tape-and-reel assembly.

Career Highlights

Troxtell’s recorded patent contribution focuses on semiconductor packaging and manufacturing processes. The invention’s combination of heat resistance, moisture removal, and airflow addresses practical requirements for preparing integrated circuits.

Collaborations

The supplied information identifies Michael Louis Hayden as Troxtell’s coworker. It does not specify whether Hayden contributed to the patent or describe the nature of their collaboration.

Conclusion

Clessie Troxtell’s patent reflects a focused contribution to integrated-circuit packaging, with a reel designed to support high-temperature processing and efficient airflow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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