Oshkosh, WI, United States of America

Claudia Helena Javenkoski

This inventor holds 1 USPTO granted patent. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Claudia Helena Javenkoski. Retrieved from https://idiyas.com/inventor/claudia-helena-javenkoski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Years Active: 2013

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Claudia Helena Javenkoski: Innovator in Embossed Tissue Technology

Introduction

Claudia Helena Javenkoski is a notable inventor based in Oshkosh, WI (US). She has made significant contributions to the field of tissue technology, particularly with her innovative patent for an embossed tissue sheet. Her work exemplifies the spirit of creativity and advancement in the industry.

Latest Patents

Claudia holds a patent for an embossed tissue sheet, which showcases her ability to blend functionality with design. This invention is a testament to her innovative thinking and dedication to improving everyday products.

Career Highlights

Throughout her career, Claudia has demonstrated a commitment to innovation and excellence. Her patent reflects her expertise and understanding of material science, positioning her as a valuable contributor to her field.

Collaborations

Claudia has collaborated with talented individuals such as Benjamin C Sarbo and Tammy Lynn Baum. These partnerships have enriched her work and expanded the impact of her inventions.

Conclusion

Claudia Helena Javenkoski is a remarkable inventor whose work in embossed tissue technology has made a lasting impression. Her contributions continue to inspire innovation in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…