This inventor holds 2 USPTO granted patents. Top assignee: Thermal Corporation. Active years: 2010-2012.
Company Filing History:
Years Active: 2010-2012
Title: Clark Scott Schaeffer: Innovator in Flexible Heat Pipe Technology
Introduction
Clark Scott Schaeffer is a notable inventor based in Ephrata, PA (US). He has made significant contributions to the field of thermal management, particularly in the design of flexible heat pipes. With a total of 2 patents, Schaeffer's work focuses on enhancing the efficiency of heat transfer in electronic components.
Latest Patents
Schaeffer's latest patents include a groundbreaking design for a flexible heat pipe with axial and lateral flexibility. This innovative heat pipe is specifically designed for use with evaporator and condenser elements to effectively remove heat from electronic components. The flexible heat pipe features a bellows member that is fixed at one end to a condenser member and at the opposite end to an evaporator member. Inside the bellows, a cable artery is fixed at one end to the evaporator and slidingly engages the condenser at the opposite end. The bellows serves as a flexible vapor envelope, while the cable artery functions as a flexible wick, directing condensed working fluid from the condenser back to the evaporator. This design allows for relative axial and lateral movement between the condenser and evaporator, providing desired vibration isolation of the two components.
Career Highlights
Clark Scott Schaeffer is currently associated with Thermal Corporation, where he continues to innovate in the field of thermal management. His work has been instrumental in developing solutions that enhance the performance and reliability of electronic systems.
Collaborations
Schaeffer has collaborated with notable colleagues, including John Gilbert Thayer and Samuel W Apicelli, contributing to advancements in thermal technology.
Conclusion
Clark Scott Schaeffer's contributions to flexible heat pipe technology demonstrate his commitment to innovation in thermal management. His patents reflect a deep understanding of the challenges faced in electronic cooling, and his work continues to influence the industry.
