Company Filing History:
Years Active: 2023
Title: Cing-He Chen: Innovator in Semiconductor Packaging
Introduction
Cing-He Chen is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance heat dissipation.
Latest Patents
Cing-He Chen holds a patent for a semiconductor package with heat dissipation films and the manufacturing method thereof. This semiconductor package includes a redistribution structure, at least one semiconductor device, and a plurality of heat dissipation films. The semiconductor device is mounted on the redistribution structure, while the heat dissipation films are arranged side by side to cover the upper surface of the semiconductor device. This design not only improves thermal management but also enhances the overall performance of semiconductor devices.
Career Highlights
Cing-He Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on developing advanced packaging solutions that meet the growing demands of modern electronics.
Collaborations
Cing-He has collaborated with talented coworkers, including Ting-Yu Yeh and Kuo-Chiang Ting, to further advance semiconductor technologies.
Conclusion
Cing-He Chen's innovative work in semiconductor packaging exemplifies the importance of effective thermal management in electronics. His contributions continue to influence the industry and pave the way for future advancements.