Company Filing History:
Years Active: 2015
Title: Innovations by Cing He Chen in Semiconductor Packaging
Introduction
Cing He Chen is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in improving the yield of packaging processes.
Latest Patents
Cing He Chen holds a patent for a "System and method to improve package and 3DIC yield in underfill process." This innovative method involves forming a packaging unit by attaching a die to a packaging substrate. The process includes applying plasma treatment to a specific portion of the substrate while leaving another portion untreated, which enhances the application of underfill material.
Career Highlights
Cing He Chen is associated with Taiwan Semiconductor Manufacturing Company Ltd., where he has been instrumental in advancing packaging technologies. His work focuses on optimizing processes that are critical for the efficiency and reliability of semiconductor devices.
Collaborations
Cing He Chen collaborates with talented colleagues, including Yen-Hsin Liu and Kewei Zuo, who contribute to the innovative environment at their workplace.
Conclusion
Cing He Chen's contributions to semiconductor packaging through his patented methods demonstrate his commitment to innovation in the industry. His work continues to influence advancements in technology and manufacturing processes.