Dunellen, NJ, United States of America

Cindy M Pribble

This inventor holds 1 USPTO granted patent. Top assignee: Agere Systems Guardian Corp.. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cindy M Pribble. Retrieved from https://idiyas.com/inventor/cindy-m-pribble

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 153(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Cindy M Pribble

Introduction

Cindy M Pribble is a notable inventor based in Dunellen, NJ (US). He has made significant contributions to the field of three-dimensional printing. His innovative approach has led to the development of a unique process for forming integrated structures.

Latest Patents

Cindy holds 1 patent for his invention titled "Process for forming integrated structures using three dimensional printing techniques." This patent describes an improved method for creating structures through three-dimensional printing. The process involves depositing a first type of powder material to form a layer, applying a binder material to define specific regions, and removing unbound powder to achieve the desired shape.

Career Highlights

Cindy has worked with Agere Systems Guardian Corp., where he has applied his expertise in three-dimensional printing technologies. His work has been instrumental in advancing the capabilities of integrated structures.

Collaborations

Cindy has collaborated with talented individuals such as David W Johnson, Jr and Gregory Peter Kochanski. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Cindy M Pribble's contributions to three-dimensional printing exemplify the spirit of innovation. His patent and career achievements highlight the importance of creativity in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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