Changhua, Taiwan

Chyi-Feng Huang

This inventor holds 1 USPTO granted patent. Top assignee: Sdi Corporation. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chyi-Feng Huang. Retrieved from https://idiyas.com/inventor/chyi-feng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Chyi-Feng Huang

Introduction

Chyi-Feng Huang is a notable inventor based in Changhua, Taiwan. He has made significant contributions to the field of stapling technology. His innovative designs aim to enhance the functionality and efficiency of staplers.

Latest Patents

Chyi-Feng Huang holds a patent for a "Stapler and multi-inclined anvil structure thereof." This invention features a multi-inclined anvil structure that includes a body, an operating portion, and a flattening surface. The design addresses common issues faced when stapling multiple sheets of paper, ensuring a well-clinched quality and resolving staple-sliding problems.

Career Highlights

Huang is associated with Sdi Corporation, where he continues to develop and refine his inventions. His work has garnered attention for its practical applications and innovative approach to everyday tools.

Collaborations

Chyi-Feng Huang collaborates with talented individuals such as Cheng-Chang Huang and Ching-Li Chen. Their teamwork contributes to the advancement of stapling technology and other related innovations.

Conclusion

Chyi-Feng Huang's contributions to stapling technology exemplify the impact of innovative thinking in everyday tools. His patent reflects a commitment to improving user experience and functionality in office supplies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…