Chunyan Zhao

Title: Chunyan Zhao and Compact Embedded Power Packaging

Introduction

Chunyan Zhao is an inventor based in Shanghai, China, whose patent work addresses compact packaging for power-supply applications. The available information identifies her as a woman and lists one patent.

Latest Patents

Zhao’s patent, “Embedded Package Structure and Power Supply Apparatus,” describes stacking smaller electronic components and arranging them in two dimensions within a substrate frame alongside a larger inductor. This configuration is designed to reduce the package’s occupied area and overall size, supporting integration and miniaturization. The patent also describes placing a chip on the embedded package structure, positioning the chip—the apparatus’s main heat source—on the power supply’s surface.

Career Highlights

Zhao is associated with Huawei Digital Power Technologies Co., Ltd. Her listed patent focuses on component arrangement and packaging design for smaller power-supply apparatuses.

Collaborations

The provided information names Chao Shen and Kuanming Bao as Zhao’s coworkers. It does not specify their roles in the patent or whether they collaborated on it.

Conclusion

Chunyan Zhao’s listed invention presents an approach to reducing the size of embedded power packaging while supporting component integration and chip placement.