Company Filing History:
Years Active: 2022
Title: Innovations of Chunpeng Wang in Biomass-Based Conductive Hydrogels
Introduction
Chunpeng Wang is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of materials science, particularly in the development of innovative hydrogels. His work focuses on sustainable materials that can be utilized in various applications.
Latest Patents
Chunpeng Wang holds a patent for a method titled "Method for preparing biomass-based conductive hydrogel by 3D printing." This innovative method involves mixing a cellulose-based macromonomer, a rosin-based monomer, an acrylic acid monomer, and an initiator in specific proportions. The mixture is stirred and dissolved at temperatures ranging from 25 to 70°C. Subsequently, diisocyanate is added to create a 3D printing photosensitive resin solution. Using an SLA light-curing 3D printer, a hydrogel precursor is printed, which is then subjected to heating and swelling processes to yield the final biomass-based conductive hydrogel. This invention showcases the potential of 3D printing technology in creating advanced materials.
Career Highlights
Chunpeng Wang is affiliated with the Institute of Chemical Industry of Forest Products, where he conducts research and development in innovative materials. His work has led to advancements in the field of hydrogels, emphasizing the importance of sustainable practices in material science. With a total of 1 patent, he continues to explore new methodologies and applications for his inventions.
Collaborations
Chunpeng Wang collaborates with esteemed colleagues such as Fuxiang Chu and Jifu Wang. Their combined expertise contributes to the advancement of research in the field of chemical engineering and materials science.
Conclusion
Chunpeng Wang's innovative approach to developing biomass-based conductive hydrogels through 3D printing exemplifies the intersection of sustainability and technology. His contributions to the field are paving the way for future advancements in material applications.