Shandong, China

Chunlin Zhang

This inventor holds 1 USPTO granted patent. Top assignee: Qingdao University of Technology. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chunlin Zhang. Retrieved from https://idiyas.com/inventor/chunlin-zhang-9lqpy7vm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Chunlin Zhang in Assembly Monitoring

Introduction

Chunlin Zhang is an accomplished inventor based in Shandong, China. He has made significant contributions to the field of assembly monitoring through his innovative methods and devices. His work focuses on utilizing deep learning techniques to enhance the efficiency and accuracy of assembly processes.

Latest Patents

Chunlin Zhang holds a patent for an "Assembly monitoring method and device based on deep learning, and readable storage medium." This invention relates to a method that involves creating a training set for a physical assembly body. The training set includes a depth image set and a label image set of a 3D assembly body from multiple monitoring angles. The method allows for the identification of parts in the assembly body, monitoring assembly steps, and detecting assembly errors.

Career Highlights

Chunlin Zhang is affiliated with Qingdao University of Technology, where he applies his expertise in deep learning to advance research in assembly monitoring. His innovative approach has garnered attention in the academic and industrial sectors, showcasing the potential of deep learning in practical applications.

Collaborations

Chunlin Zhang collaborates with notable colleagues, including Jun Hong and Chengjun Chen. Their combined efforts contribute to the development of advanced technologies in assembly monitoring.

Conclusion

Chunlin Zhang's work exemplifies the intersection of deep learning and assembly processes, paving the way for future innovations in the field. His contributions are vital for enhancing the efficiency and reliability of assembly operations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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