Shenzhen, China

Chunjia Sun

This inventor holds 1 USPTO granted patent. Top assignee: Cloud Intelligence Assets Holding (Singapore) Private Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chunjia Sun. Retrieved from https://idiyas.com/inventor/chunjia-sun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Chunjia Sun and Modular Computer Expansion Technology.

Introduction

Chunjia Sun is an inventor associated with Shenzhen, China. His work includes a patent for a computer expansion module designed to connect external devices while supporting high-speed signal transmission.

Latest Patents

The patent, “Expansion Module, PCIE Expansion Module, Chassis Assembly, Computer, and Server Cluster,” describes a detachable bracket and a circuit board that connects a computer to an external device. The board’s electrical connection structure links to the computer through a cable, while its port extends through an opening in the bracket’s end plate for access when installed. The design may omit an interface board, which can help improve high-speed signal transmission quality. Sun is associated with 1 patent in the information provided.

Career Highlights

Sun is associated with Cloud Intelligence Assets Holding (Singapore) Private Limited. His patent focuses on modular computer hardware and connectivity, with potential applications in computers, chassis assemblies, and server clusters.

Collaborations

Yongbao He is identified as Sun’s coworker. The available information does not specify their roles or describe a particular joint project.

Conclusion

Chunjia Sun’s documented invention addresses practical computer expansion needs through a detachable module that integrates device connectivity and may support improved signal transmission.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…