This inventor holds 1 USPTO granted patent and 5 published patent applications and 1 EPO patent. Top assignee: Delta Electronics, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chung-Yi Chen: Innovator in Flexible Copper Clad Laminates
Introduction
Chung-Yi Chen is an inventor based in Taoyuan City, Taiwan. He is currently associated with Delta Electronics, Inc. Although he does not have any granted patents, his work in the field of flexible copper clad laminates showcases his innovative spirit and technical expertise.
Latest Patent Applications
Chung-Yi Chen has submitted several patent applications related to flexible copper clad laminates. One of his notable applications describes a flexible copper clad laminate that includes a polyimide substrate and a nickel-copper alloy layer formed on at least one surface of the substrate by electroless plating. This alloy layer contains nickel, copper, and phosphorus, with specific weight ratios and content levels that enhance its performance. The copper layer is formed on the side of the nickel-copper alloy layer that is away from the polyimide substrate, creating a metal conducting layer suitable for high-frequency transmission. Another application details a flexible copper clad laminate with electrochemical corrosion resistance and sufficient peel strength, facilitating the production of flexible printed circuit boards.
Conclusion
Chung-Yi Chen's contributions to the field of flexible copper clad laminates reflect his commitment to innovation and advancement in technology. His latest patent applications highlight the potential for improved materials in electronic applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile