Chung-Ting Liu

Title: Chung-Ting Liu: Innovator in Semiconductor Technology

Introduction

Chung-Ting Liu is a notable inventor based in Wescosville, Pennsylvania, recognized for his contributions to semiconductor technology. With a patent to his name, he has demonstrated a profound understanding of integrated circuit fabrication processes.

Latest Patents

Liu's patent, titled "Integrated circuit and manufacture," presents a method for fabricating semiconductor integrated circuits. This innovative technique includes forming punch-through control implants that enhance the performance of the semiconductor. The inventive process involves the formation of a dielectric that covers the gate and the exposed portions of a semiconductor substrate. Notably, the dielectric is engineered to be more vulnerable to wet etching adjacent to the gate sidewalls, allowing for precise channel formation that exposes the substrate. By utilizing Tetraethyl Orthosilicate (TEOS) and incorporating NF₃ during the deposition process, Liu's approach enables more efficient etching techniques and improved ion implantation outcomes.

Career Highlights

Chung-Ting Liu is employed at AT&T Corp., where he leverages his skills and expertise in semiconductor design and fabrication. His innovative work has the potential to significantly impact the performance of integrated circuits in the telecommunications sector.

Collaborations

Throughout his career, Liu has collaborated with esteemed colleagues, including Kuo-Hua Lee and Kurt George Steiner. Their combined efforts in advancing semiconductor technologies reflect a commitment to innovation within the industry.

Conclusion

Chung-Ting Liu's dedication to the field of semiconductor technology, highlighted by his patent on integrated circuit fabrication, showcases his role as an influential inventor. As he continues to work with leading professionals at AT&T Corp., his contributions are set to influence future advancements in integrated circuits and semiconductor manufacturing processes.