Chung Shin Mou

Title: Innovations of Chung Shin Mou

Introduction

Chung Shin Mou is a notable inventor based in Tu-Chen, Taiwan. He has made significant contributions to the field of optical packaging technology. His innovative work has led to the development of a unique optical package structure that enhances the efficiency of optical components.

Latest Patents

Chung Shin Mou holds a patent for an optical package structure. This structure includes a cover with a lens part and a base member that combines with the cover to define a closed space for packaging optical components. The base member features a bottom panel and a substrate, with a plurality of solder pads on both the top and bottom surfaces. These solder pads on the top surface are designed to electrically connect with the optical components. Additionally, inner conductive traces are provided through the bottom panel and the substrate, allowing for an external electrical connection of the optical components without the need for wires and electrical pins.

Career Highlights

Chung Shin Mou is associated with Hon Hai Precision Industry Co., Ltd., a leading company in the electronics manufacturing sector. His work at this company has allowed him to focus on advancing optical technologies and improving product designs.

Collaborations

Chung Shin Mou has collaborated with his coworker, Nan Tsung Huang, to further enhance the development of optical packaging solutions. Their teamwork has contributed to the successful implementation of innovative technologies in their projects.

Conclusion

Chung Shin Mou's contributions to optical packaging technology demonstrate his expertise and innovative spirit. His patent for the optical package structure showcases his ability to create efficient solutions for modern optical components.