Chung-Ming Cheng

Title: Innovations of Chung-Ming Cheng

Introduction

Chung-Ming Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work is recognized for its innovative approaches to leadframe design and adhesive applications.

Latest Patents

Cheng's latest patents include the "Angled die pad of a leadframe for a molded integrated circuit package." This invention features a leadframe with a plurality of leads, where the die pad is strategically positioned closer to the proximal ends of the leads, creating an edge that intersects the linear axis at an angle less than 90 degrees. Another significant patent is the "Dam laminate isolation substrate," which describes an apparatus that includes a lead frame, a dam, and adhesive. This design allows for effective integration of an integrated circuit die while preventing adhesive from spreading into the space between lead frames.

Career Highlights

Chung-Ming Cheng is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of electronics. His work has contributed to advancements in integrated circuit technology, enhancing the efficiency and reliability of electronic devices.

Collaborations

Cheng has collaborated with talented coworkers, including Chang-Yen Ko and Megan Chang, who have also contributed to the development of innovative technologies in their respective fields.

Conclusion

Chung-Ming Cheng's contributions to integrated circuit packaging through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the electronics industry. His inventions continue to influence the design and functionality of modern electronic devices.