Taipei, Taiwan

Chung-Hong Lin

This inventor holds 2 USPTO granted patents. Top assignee: Compal Electronics, Inc.. Active years: 2013-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Hong Lin. Retrieved from https://idiyas.com/inventor/chung-hong-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2013-2014

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2 patents (USPTO):Explore Patents

Title: Innovations of Chung-Hong Lin

Introduction

Chung-Hong Lin is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic devices, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

Chung-Hong Lin's latest patents include an electronic apparatus and a speaker. The electronic apparatus features a housing, an electronic device, and an electronic device fixing module. This design incorporates a protrusion on the electronic device and a resilient positioning element that prevents movement along multiple axes. The speaker patent describes a unique structure that includes a base, diaphragm, and separating module, allowing for the effective export of sound from two distinct chambers.

Career Highlights

Chung-Hong Lin is currently employed at Compal Electronics, Inc., where he continues to develop innovative solutions in electronic technology. His work has contributed to advancements in the design and functionality of electronic devices.

Collaborations

Chung-Hong Lin has collaborated with talented coworkers such as Chih-Chun Liu and Shao-Tsu Kung, enhancing the creative process and fostering innovation within his team.

Conclusion

Chung-Hong Lin's contributions to electronic device innovation reflect his dedication and expertise in the field. His patents not only demonstrate his inventive capabilities but also highlight the importance of collaboration in achieving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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