Kaohsiung, Taiwan

Chung-Chi Yang

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Ic Packaging Corporation. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Chi Yang. Retrieved from https://idiyas.com/inventor/chung-chi-yang-ajdkhwo0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations by Chung-Chi Yang

Introduction

Chung-Chi Yang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of sensor technology, particularly with his innovative designs and methods.

Latest Patents

Chung-Chi Yang holds a patent for a "Contact sensor and method for making the same." This invention includes a base with a wall device securely attached to its top face. The wall device features a hole that corresponds to the top contacts, allowing them to be exposed. Additionally, it has a chip receiving space that communicates with the hole. A sensing chip is received in this space, featuring a sensing area and contacts that connect electrically to the top contacts of the base. A cover is also included to enclose the contacts while keeping the sensing area exposed for application.

Career Highlights

Chung-Chi Yang is currently employed at Taiwan IC Packaging Corporation, where he continues to develop innovative technologies. His work has been instrumental in advancing sensor applications in various industries.

Collaborations

He has collaborated with notable coworkers, including Ching-Chung Tseng and Hsiu-Chung Lin, contributing to a dynamic and innovative work environment.

Conclusion

Chung-Chi Yang's contributions to sensor technology exemplify the spirit of innovation. His patent and ongoing work at Taiwan IC Packaging Corporation highlight his commitment to advancing technology in meaningful ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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