This inventor holds 1 USPTO granted patent. Top assignee: Metal Industries Research & Development Centre. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Innovations of Chung-Chen Huang in Electromagnetic Shielding
Introduction
Chung-Chen Huang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electromagnetic shielding materials. His innovative approach has led to the development of a unique manufacturing method that enhances the effectiveness of these materials.
Latest Patents
Chung-Chen Huang holds a patent for a "Clad type electromagnetic shielding material and method for manufacturing the same." This patent describes a method that involves stacking a first electrically conductive metallic layer, a magnetically conductive metallic layer, a second electrically conductive metallic layer, and a shock-absorbing insulation layer. These layers are processed through a clad type rolling technique to create a clad plate suitable for electromagnetic shielding applications. The design ensures that the surface of the shock-absorbing insulation layer, which contains a binder, faces the second electrically conductive metallic layer.
Career Highlights
Chung-Chen Huang is associated with the Metal Industries Research & Development Centre, where he continues to explore advancements in material science. His work focuses on improving the performance and manufacturing processes of electromagnetic shielding materials.
Collaborations
Chung-Chen Huang collaborates with fellow researchers, including Chien-Sin Huang and Chien-Hung Huang, to further enhance the development of innovative materials in their field.
Conclusion
Chung-Chen Huang's contributions to electromagnetic shielding technology demonstrate his commitment to innovation and research. His patented methods and collaborative efforts continue to influence advancements in material science.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
