Chundong Li

Title: Chundong Li: Innovator in Semiconductor Manufacturing

Introduction

Chundong Li is a prominent inventor based in Beijing, China. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative approaches to etching methods.

Latest Patents

Chundong Li holds a patent for a via-hole etching method. This invention addresses the challenges associated with conventional via-hole etching methods, such as the uncontrollable end point and unfavorable profile-angle. The method involves forming a structure for via-hole etching, which includes a low-temperature poly-silicon layer, a gate insulating layer, a gate metal layer, and an interlayer insulating layer on a substrate. The process includes forming a mask layer with a via-hole masking pattern, followed by a two-step etching process to create a precise via-hole structure.

Career Highlights

Throughout his career, Chundong Li has worked with notable companies in the semiconductor industry. He has been associated with BOE Technology Group Co., Ltd. and Chengdu BOE Optoelectronics Technology Co., Ltd. His work in these organizations has contributed to advancements in semiconductor technologies.

Collaborations

Chundong Li has collaborated with esteemed colleagues in his field, including Byung Chun Lee and Donghua Jiang. These collaborations have fostered innovation and development in semiconductor manufacturing techniques.

Conclusion

Chundong Li's contributions to the semiconductor manufacturing industry through his innovative etching methods highlight his role as a key inventor. His work continues to influence advancements in technology and manufacturing processes.