Company Filing History:
Years Active: 2020-2023
Title: Innovations of Inventor Chun Yin
Introduction
Chun Yin is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of mechanical engineering and imaging technology. With a total of 5 patents, his work focuses on high-precision reconstruction methods and defect identification in composite materials.
Latest Patents
Chun Yin's latest patents include a "Method for high-precision true color three-dimensional reconstruction of a mechanical component." This innovative method utilizes high-resolution grayscale cameras and a low-resolution color camera to achieve non-contact, high-precision reconstruction of mechanical components. The technique enhances measurement accuracy by capturing richer texture details through the use of binocular high-precision grayscale cameras.
Another notable patent is the "Method for quantitatively identifying the defects of large-size composite material based on infrared image sequence." This method involves analyzing infrared images to identify defect areas in composite materials. By extracting defect areas and analyzing thermal response curves, the method allows for accurate quantitative identification of defects, improving the reliability of composite materials.
Career Highlights
Chun Yin is affiliated with the University of Electronic Science and Technology of China, where he continues to advance research in his field. His innovative approaches have garnered attention and recognition within the academic and engineering communities.
Collaborations
Chun Yin has collaborated with notable colleagues, including Yuhua Cheng and Kai Chen. Their combined expertise contributes to the advancement of technology and innovation in their respective fields.
Conclusion
Chun Yin's contributions to mechanical engineering and imaging technology through his patents demonstrate his commitment to innovation. His work not only enhances measurement techniques but also improves the reliability of materials used in various applications.