The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Aug. 13, 2021
University of Electronic Science and Technology of China, Sichuan, CN;
Yuhua Cheng, Chengdu, CN;
Chun Yin, Chengdu, CN;
Xiao Yang, Chengdu, CN;
Kai Chen, Chengdu, CN;
Xuegang Huang, Chengdu, CN;
Gen Qiu, Chengdu, CN;
Yinze Wang, Chengdu, CN;
UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA, Chengdu, CN;
Abstract
The present invention provides a method for quantitatively identifying the defects of large-size composite material based on infrared image sequence, firstly obtaining the overlap area of an infrared splicing image, and dividing the infrared splicing image into three parts according to overlap area: overlap area, reference image area and registration image area, then extracting the defect areas from the infrared splicing image to obtain P defect areas, then obtaining the conversion coordinates of pixels of defect areas according to the three parts of the infrared splicing image, and further obtaining the transient thermal response curves of centroid coordinate and edge point coordinates, finding out the thermal diffusion points from the edge points of defect areas according to a created weight sequence and dynamic distance threshold ε×d, finally, based on the thermal diffusion points, the accurate identification of quantitative size of defects are completed.