Chun Yi Teng

Title: Innovations of Chun Yi Teng in Wafer Level Chip Scale Packaging

Introduction

Chun Yi Teng is a notable inventor based in Singapore, recognized for her contributions to semiconductor technology. With a focus on manufacturing processes, she has developed innovative methods that enhance the efficiency and effectiveness of chip packaging.

Latest Patents

Chun Yi Teng holds a patent for a "Method for manufacturing a wafer level chip scale package (WLCSP)." This patent describes a process where trenches are opened from the top surface of a production wafer, extending down through scribe areas to a depth that is only partially through a semiconductor substrate. Prior to the bumping process, a first handle is attached to the top surface of the production wafer. The back surface of the semiconductor substrate is then thinned to reach the trenches, forming a wafer level chip scale package at each integrated circuit location delimited by the trenches. A second handle is attached to the bottom surface of the thinned semiconductor substrate, and the first handle is removed to expose underbump metallization pads at the top surface. The bumping process is then performed to form a solder ball at each of the exposed underbump metallization pads.

Career Highlights

Chun Yi Teng is currently employed at STMicroelectronics GmbH, a leading company in semiconductor solutions. Her work focuses on advancing manufacturing techniques that contribute to the development of more efficient electronic devices.

Collaborations

Chun Yi Teng collaborates with her coworker, David Gani, who plays a significant role in their joint projects. Together, they work on innovative solutions that push the boundaries of semiconductor technology.

Conclusion

Chun Yi Teng's contributions to wafer level chip scale packaging demonstrate her expertise and commitment to innovation in the semiconductor industry. Her patent reflects a significant advancement in manufacturing processes, showcasing her role as a key inventor in this field.