Chun-Yen Liao

Title: The Innovative Contributions of Chun-Yen Liao

Introduction

Chun-Yen Liao is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of memory devices, showcasing his expertise through his innovative patents. His work is characterized by a focus on enhancing the efficiency and functionality of memory technology.

Latest Patents

Chun-Yen Liao holds a patent for a "Pick-up structure for memory device and manufacturing method thereof." This invention presents a pick-up structure that includes a substrate and multiple pick-up electrode strips. The substrate features a memory cell region and a peripheral pick-up region adjacent to it. The pick-up electrode strips are arranged in a unique manner, with one direction being parallel to a first direction and the other in a second direction that differs from the first. Each strip consists of a main part located in the peripheral pick-up region and an extension part that extends into the memory cell region. The design of the main part is defined by fork-shaped patterns of a first mask layer, while the extension part has a narrower width and aligns with the side wall surface of the main part.

Career Highlights

Chun-Yen Liao is currently employed at Windbond Electronics Corporation, where he continues to develop innovative solutions in memory technology. His work has been instrumental in advancing the capabilities of memory devices, making them more efficient and effective for various applications.

Collaborations

Chun-Yen has collaborated with talented coworkers, including Tsung-Wei Lin and Kun-Che Wu, who contribute to the innovative environment at Windbond Electronics Corporation.

Conclusion

Chun-Yen Liao's contributions to the field of memory devices through his patent and work at Windbond Electronics Corporation highlight his role as a significant inventor in the technology sector. His innovative approach continues to influence advancements in memory technology.