This inventor holds 3 USPTO granted patents. Top assignees: Industrial Technology Research Institute, Kinpo Electronics, Inc.. Active years: 1998-2004.
Location History:
- Hsin Chu, TW (2000)
- Taipei, TW (1998 - 2004)
Company Filing History:

Years Active: 1998-2004
Title: Innovations of Chun-Yang Cheng
Introduction
Chun-Yang Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the areas of assembly line efficiency and memory storage systems. With a total of 3 patents, his work reflects a commitment to enhancing industrial processes and improving data management.
Latest Patents
One of his latest patents is a "Working platform for assembly line." This invention includes a frame mounted over a conveying belt of the assembly line, featuring a guiding mechanism that enhances assembly precision by stopping workpieces on the platform. This innovation reduces both labor and cost associated with assembly tasks.
Another significant patent is titled "Methods and systems for storing texels retrievable in a single cycle." This invention discloses methods for storing texels in memory banks, allowing the retrieval of four neighboring texels within a single cycle. By optimizing memory access time, this system improves the efficiency of color value interpolation in texel buffers.
Career Highlights
Chun-Yang Cheng has worked with prominent organizations such as the Industrial Technology Research Institute and Kinpo Electronics, Inc. His experience in these companies has contributed to his expertise and innovative capabilities in technology.
Collaborations
Throughout his career, he has collaborated with talented individuals, including Yu-Ming Lin and Erh-Chiao Wang. These partnerships have likely fostered a creative environment that encourages innovation and the development of new ideas.
Conclusion
Chun-Yang Cheng's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in assembly line processes and memory storage systems.