Chun-Wu Liu

Title: Innovations of Chun-Wu Liu in Semiconductor Packaging

Introduction

Chun-Wu Liu is a notable inventor based in Hukou, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly recognized for enhancing the reliability of semiconductor packages.

Latest Patents

Chun-Wu Liu holds a patent for a "Stacked semiconductor package and packaging method thereof." This invention features a substrate, a first chip, at least one spacer, a second chip, and an encapsulation. The design allows the first and second chips to be intersecting and stacked on the substrate, with spacers providing support for the second chip. The encapsulation is designed to cover the substrate, the first chip, the spacers, and the second chip. Notably, the spacers are made from the same material as the encapsulation, which enhances adhesion and prevents delamination during reliability tests. This innovation significantly improves the reliability of stacked semiconductor packages.

Career Highlights

Chun-Wu Liu is currently employed at Powertech Technology Inc., a leading company in the semiconductor industry. His work at Powertech has allowed him to focus on developing advanced packaging solutions that meet the growing demands of technology.

Collaborations

Chun-Wu Liu has collaborated with talented coworkers such as Yin-Huang Kung and Chia-Hung Lin. Their combined efforts contribute to the innovative projects at Powertech Technology Inc.

Conclusion

Chun-Wu Liu's contributions to semiconductor packaging through his patented innovations demonstrate his commitment to enhancing technology reliability. His work continues to influence the semiconductor industry positively.