Chun-Wei Tseng

Title: Innovations of Chun-Wei Tseng

Introduction

Chun-Wei Tseng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the development of innovative devices. With a total of 2 patents to his name, Tseng continues to push the boundaries of invention.

Latest Patents

His latest patents include a detachable smartphone protective device with a backup power unit and a mold assembly with a latching device. The mold assembly consists of a first mold, a second mold, a first locking member, a second locking member, and a pushing member. The first locking member is fixed in the first mold and features an engaging slot. The second locking member is pivotably mounted in the second mold and includes an engaging portion. This engaging portion is designed to latch the first mold to the second mold, while the pushing member is adapted to disengage the engaging portion from the engaging slot.

Career Highlights

Throughout his career, Chun-Wei Tseng has worked with various companies, including Taer Innovation Co., Ltd. and Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects.

Collaborations

Tseng has collaborated with talented individuals such as Li-Ming Hu and Yu-Chun Lu. These partnerships have fostered a creative environment that has led to the development of innovative solutions.

Conclusion

Chun-Wei Tseng is a prominent inventor whose work continues to influence the technology landscape. His patents and collaborations reflect his commitment to innovation and excellence in his field.