Ilan Hsien, Taiwan

Chun-Wei Lin

This inventor holds 1 USPTO granted patent. Top assignee: Silitech Technology Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Wei Lin. Retrieved from https://idiyas.com/inventor/chun-wei-lin-1cy92dut

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2008

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Chun-Wei Lin

Introduction

Chun-Wei Lin is a notable inventor based in Ilan Hsien, Taiwan. He has made significant contributions to the field of key module technology. His innovative approach has led to the development of a unique manufacturing method that enhances the functionality and aesthetics of key modules.

Latest Patents

Chun-Wei Lin holds a patent for a key module and its manufacturing method. The patent outlines a process that includes providing a mold, forming a key body with multiple opening portions, and jostling a combination of a display body and an elastic body to the key body. The method ensures that the gap between the key body and the display body is minimized to less than 0.01 mm, resulting in an almost seamless appearance for the key module.

Career Highlights

Chun-Wei Lin is currently employed at Silitech Technology Corporation, where he continues to innovate in the field of key modules. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Chun-Wei Lin collaborates with talented coworkers such as Yu-Tsai Wang and Yu-Yen Lien. Together, they contribute to the innovative projects at Silitech Technology Corporation.

Conclusion

Chun-Wei Lin's contributions to key module technology exemplify the spirit of innovation. His patent and ongoing work at Silitech Technology Corporation highlight his commitment to advancing technology in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…