Company Filing History:
Years Active: 2017
Title: Innovations by Chun-Ting Lu in Semiconductor Technology
Introduction
Chun-Ting Lu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and manufacturing of semiconductor packages. His innovative work has led to the development of advanced solutions that enhance the performance and reliability of electronic devices.
Latest Patents
Chun-Ting Lu holds 1 patent for his invention titled "Semiconductor packages and related manufacturing methods." This patent describes semiconductor packages that include an insulating layer and outlines the manufacturing methods associated with them. The design features a die pad, a plurality of leads surrounding the die pad, and a chip that is electrically connected to the leads. The encapsulation of the chip and the leads with a molding compound ensures durability, while the insulating layer enhances functionality.
Career Highlights
Chun-Ting Lu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technology. His work is instrumental in advancing the capabilities of semiconductor devices, which are critical components in modern electronics.
Collaborations
Chun-Ting Lu collaborates with talented colleagues such as Chun-Hung Lin and Yi-Ting Chen. Their combined expertise fosters a creative environment that drives innovation in their projects.
Conclusion
Chun-Ting Lu's contributions to semiconductor technology exemplify the impact of innovative thinking in the electronics industry. His patent on semiconductor packages showcases his commitment to enhancing device performance and reliability.