Chun Sing Colin Lum

Title: Innovations by Chun Sing Colin Lum

Introduction

Chun Sing Colin Lum is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique method for fabricating flip chip packages.

Latest Patents

Chun Sing Colin Lum holds a patent for a method titled "Method for fabricating a flip chip package with pillar bump and no flow underfill." This invention describes a technique for joining a semiconductor integrated circuit (IC) chip in a flip chip configuration using pillar bumps. The method allows for the attachment of the semiconductor device to the substrate via no flow underfill under thermal compression bonding. This integration enables the use of low coefficient of thermal expansion (CTE) no flow underfill, achieving high assembly yield, particularly for lead-free bumps. The invention addresses the challenges of creating flip chip packages with fine pitch, high pin count, and lead-free requirements.

Career Highlights

Chun Sing Colin Lum is currently employed at Advanpack Solutions Pte Ltd. His work focuses on advancing semiconductor packaging technologies. He has demonstrated a commitment to innovation and excellence in his field.

Collaborations

Chun Sing Colin Lum collaborates with talented coworkers, including Tie Wang and Ping Miao. Their combined expertise contributes to the success of their projects and the advancement of technology in semiconductor packaging.

Conclusion

Chun Sing Colin Lum's contributions to the field of semiconductor packaging through his innovative patent highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future advancements.