Company Filing History:
Years Active: 2009
Title: Innovations of Chun-Ping Hu in Bumping Processes
Introduction
Chun-Ping Hu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the development of bumping processes. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Chun-Ping Hu's latest patents focus on a bumping process and bump structure. This innovative process involves forming a passivation layer with a planarized surface that covers a pad on a substrate. A hole is created to expose the contact surface of the pad, followed by the formation of a bump on both the contact surface and the planarized surface. The design of the planarized surface provides a larger effective area for pressing, which minimizes the pad and enhances the mechanical strength at its periphery. This innovation offers greater selection flexibility for anisotropic conductive film, reduces the risk of short circuits and current leakage within the bump gap, and ultimately increases the yield of the pressing process along with the conductive quality of the bump.
Career Highlights
Chun-Ping Hu is currently associated with Elan Microelectronics Corporation, where he continues to innovate and contribute to advancements in microelectronics. His expertise in bumping processes has positioned him as a key figure in his field.
Collaborations
Chun-Ping Hu has collaborated with notable colleagues such as Cheng-Chung Chen and Chien-Wen Tsi. Their combined efforts have furthered the development of innovative technologies in microelectronics.
Conclusion
Chun-Ping Hu's contributions to bumping processes exemplify his commitment to innovation in the microelectronics industry. His patents reflect a deep understanding of the technical challenges and opportunities within this field.