The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2009
Filed:
Apr. 17, 2006
Chun-ping HU, Hsinchu, TW;
Cheng-chung Chen, Hsinchu, TW;
Chien-wen Tsi, Hukou Township, Hsinchu County, TW;
Yu-ching Lee, Taishan Township, Taipei County, TW;
Chun-Ping Hu, Hsinchu, TW;
Cheng-Chung Chen, Hsinchu, TW;
Chien-Wen Tsi, Hukou Township, Hsinchu County, TW;
Yu-Ching Lee, Taishan Township, Taipei County, TW;
Elan Microelectronics Corporation, Hsinchu, TW;
Abstract
A bumping process comprises forming a passivation layer having a planarized surface covering a pad on a substrate, forming a hole penetrating through the passivation layer to expose a contact surface of the pad, and forming a bump on the contact surface and planarized surface. The planarized surface will provide a larger effective area for pressing, thereby minimizing the pad, enhancing the mechanical strength at the peripheral of the pad, providing more selection flexibility for anisotropic conductive film, reducing the possibilities of short circuit and current leakage within the bump gap, and increasing the yield of the pressing process and the conductive quality of the bump.